JPH0334655B2 - - Google Patents

Info

Publication number
JPH0334655B2
JPH0334655B2 JP56143798A JP14379881A JPH0334655B2 JP H0334655 B2 JPH0334655 B2 JP H0334655B2 JP 56143798 A JP56143798 A JP 56143798A JP 14379881 A JP14379881 A JP 14379881A JP H0334655 B2 JPH0334655 B2 JP H0334655B2
Authority
JP
Japan
Prior art keywords
film
substrate
mask
recess
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56143798A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5846647A (ja
Inventor
Sunao Shibata
Akira Kurosawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP14379881A priority Critical patent/JPS5846647A/ja
Priority to US06/384,648 priority patent/US4472874A/en
Priority to DE8282105074T priority patent/DE3279916D1/de
Priority to EP82105074A priority patent/EP0067419B1/en
Priority to CA000404883A priority patent/CA1191280A/en
Publication of JPS5846647A publication Critical patent/JPS5846647A/ja
Publication of JPH0334655B2 publication Critical patent/JPH0334655B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Local Oxidation Of Silicon (AREA)
  • Drying Of Semiconductors (AREA)
  • Element Separation (AREA)
JP14379881A 1981-06-10 1981-09-14 半導体装置の製造方法 Granted JPS5846647A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP14379881A JPS5846647A (ja) 1981-09-14 1981-09-14 半導体装置の製造方法
US06/384,648 US4472874A (en) 1981-06-10 1982-06-03 Method of forming planar isolation regions having field inversion regions
DE8282105074T DE3279916D1 (en) 1981-06-10 1982-06-09 Method of manufacturing integrated circuit devices using dielectric isolation
EP82105074A EP0067419B1 (en) 1981-06-10 1982-06-09 Method of manufacturing integrated circuit devices using dielectric isolation
CA000404883A CA1191280A (en) 1981-06-10 1982-06-10 Method of forming plunar isolation regions having field inversion regions

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14379881A JPS5846647A (ja) 1981-09-14 1981-09-14 半導体装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP20127490A Division JPH0738409B2 (ja) 1990-07-31 1990-07-31 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5846647A JPS5846647A (ja) 1983-03-18
JPH0334655B2 true JPH0334655B2 (en]) 1991-05-23

Family

ID=15347222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14379881A Granted JPS5846647A (ja) 1981-06-10 1981-09-14 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5846647A (en])

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01125935A (ja) * 1987-11-11 1989-05-18 Seiko Instr & Electron Ltd 半導体装置の製造方法
US5387540A (en) * 1993-09-30 1995-02-07 Motorola Inc. Method of forming trench isolation structure in an integrated circuit
JP4746262B2 (ja) * 2003-09-17 2011-08-10 Okiセミコンダクタ株式会社 半導体装置の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5423230A (en) * 1977-07-22 1979-02-21 Mitsubishi Rayon Eng Kk Controlling system of sulfur oxide discharge amount contained in the combustion gas

Also Published As

Publication number Publication date
JPS5846647A (ja) 1983-03-18

Similar Documents

Publication Publication Date Title
KR100227766B1 (ko) 반도체 장치 및 그 제조 방법
KR100282452B1 (ko) 반도체 소자 및 그의 제조 방법
US6110787A (en) Method for fabricating a MOS device
US6285061B1 (en) Structure and method for fabricating a field effect transistor with a self-aligned anti-punchthrough implant channel
US6069058A (en) Shallow trench isolation for semiconductor devices
US4711017A (en) Formation of buried diffusion devices
JPH0355984B2 (en])
JPH03145759A (ja) 半導体装置の製造方法
EP0276292B1 (en) Process for fabricating stacked mos structures
US5466615A (en) Silicon damage free process for double poly emitter and reverse MOS in BiCMOS application
JPH02260660A (ja) Mos型半導体装置の製造方法
JPH0334655B2 (en])
KR19980081139A (ko) Cmos 회로장치의 형성방법
JPH0334656B2 (en])
JPH09139382A (ja) 半導体装置の製造方法
JPH0738409B2 (ja) 半導体装置の製造方法
JP2564670B2 (ja) 半導体mosトランジスタの形成方法
JP2674568B2 (ja) 半導体装置の製造方法
JPH0481339B2 (en])
JP2000150870A (ja) 半導体装置およびその製造方法
JPH0779126B2 (ja) 半導体装置の製造方法
JPH0334657B2 (en])
JP2553694B2 (ja) 半導体装置およびその製造方法
JPH11354650A (ja) 半導体装置およびその製造方法
JP3031073B2 (ja) 半導体装置およびその製造方法